Electronics Forum | Wed Oct 25 12:14:35 EDT 2006 | GS
Yes SWAG you are right, heat could be dangerous for the parts to be removed. Any way it is not so easy to remove epoxy adhesive (3609) once it is cured. By heating the adhesive (over his TG temperature)it gets softened and by using a mec
Electronics Forum | Mon Nov 09 10:36:01 EST 2009 | jjfullers
We use the very common industry standard Loctite 3609 (RED) chipbonder in our process. However, one of our new customers requires that we build on RED PCB fabs. Thus our challenge when trying to inspect the bottomside epoxy. ANYONE KNOW OF ANY OTHE
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Tue Apr 02 11:50:58 EST 2002 | slthomas
"Oh. [Howabout if I smack you?]" Like I ever said anything 'bout strings. Sheesh. I'm gonna save this one for future reference. Oughta take a week or two to figure out whether yer trying to make a fool of me or not. ;) Criminy. And I was think
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
Electronics Forum | Tue Aug 14 08:06:38 EDT 2012 | milan89
Hello, I am having a problem with Universal GSM1 with the Adhesive head. It's a model with piston pump. When i try to dispens a sping that needs to push the adhesive in the syringe doesn't have power to push it. Everything is well cleaned. Maybe it'
Electronics Forum | Sun Mar 07 09:35:03 EST 1999 | Scott Cook
| Where I'm located, we call it OCC. By any other name would it smell/stink as sweet? | | I need to know, though it's been overworked, who has experience with OSP and its compatibility with water and IPA no-clean, VOC no-clean, and device adhesives
Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi
Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th
Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
