Industry News | 2022-11-29 07:29:41.0
StenTech Inc. is pleased to offer customers the ability to easily place stencil orders online with its new Online Order Management System.
Industry News | 2010-05-11 14:43:51.0
Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.
Industry News | 2016-03-30 09:22:53.0
Ersa is pleased to announce that it will exhibit a wide range of industry leading technologies in Hall 7, Booth 117 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Additionally, the company will exhibit the VERSAFLOW3/45 with VERSASCAN and VERSAEYE for the first time.
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2010-08-09 13:23:20.0
Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.
Industry News | 2018-10-17 13:19:31.0
BPM Microsystems is excited to announce several new sales teams in the US and Canada.
Industry News | 2012-11-05 19:42:49.0
Mentor Graphics announced the availability of the next-generation PADS® flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.
Industry News | 2019-04-23 08:08:27.0
Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.
Industry News | 2010-04-14 21:28:49.0
Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
Industry News | 2006-11-01 11:22:36.0
- Assembly manufacturing processing time reduced by 50%
