Industry Directory | Manufacturer
GMA IS A CONTRACT MANUFACTURER OF PRINTED CIRCUIT BOARD ASSEMBLIES, TESTING AND INTEGRATION INTO HIGHER LEVEL ASSEMBLIES OR PRODUCTS.
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
The Agilent Medalist 5DX Series 5000 offers 3-D Automatic X-Ray inspection capability, enabling inspection of both sides of a double-sided panel in one pass. Customer CAD is converted to an inspection program, enabling 100% solder joint inspection t
Industry Directory | Consultant / Service Provider / Manufacturer
Matrix Technologies designs and builds advanced off-line and in-line x-ray inspection systems for solder joint and final assembly test inspection. Matrix uses 2D, 2.5D, SFT and 3D X-ray techniques with advanced defect detection
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Industry Directory | Manufacturer
Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication.
New Equipment | Assembly Services
PCB Assembly Quickturn and Prototype PCB Assembly. That's what you need, that's what we do. We can support small engineering projects up to full turn-key, medium volume production. With in-house process verification tools like AOI, Xray and Ersas
Industry Directory | Manufacturer
Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"
Technical Library | 2021-03-18 20:07:08.0
X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies.
Industry News | 2012-03-28 23:02:09.0
Easy Braid Co. is announcing a new high-performance 3D X-ray CT System by SEC, the X-eye Micro CT.
