Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System
► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System
► Exclusive 15MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System ► 10MP
► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System
Industry News | 2021-05-14 05:35:57.0
MIRTEC announces that it has officially received IPC-2591 (CFX) Certification for its Award-Winning MV-6 OMNI 3D AOI Seriesand MS-11e 3D SPI Series.
Industry News | 2021-06-15 04:22:53.0
IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes.
Industry News | 2018-08-21 20:05:28.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.
