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Solder paste layout

Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef

I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever

Re: IR rework stations

Electronics Forum | Tue Sep 28 05:58:59 EDT 1999 | Wolfgang Busko

| | | | | | | | | | Hiya, | | | | | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | | | | | Cheers

Re: ESD....I don't wanna shock anyone, but...

Electronics Forum | Fri Jun 04 06:58:59 EDT 1999 | S. Kopetzky

| | | ok, ok, so I'm not an engineer. I'm a salesguy ( and that's nothing to be ashamed of...) Here's my dilemma. I represent a contract manufacturer who is in the early stages of quoting on "turnkey" assembling of a circuit board for a manufactu

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun

Re: DFM/DFT

Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F

Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar

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