Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Parts & Supplies | Other Equipment
CGSTAPE-8258 - 1 mil polyimide tape with silicone high-temperature insulation tape, CGS offer 1mil, 2mil, 3mil and 5 mil polyimide tape with silicone. CGS can also offer different width such as 1/4", 3/8", 1/2", 1", up to 20", to meet customers' pr
Flexibility and conformability are the key features of this product group. High heat resistance and tensile strength of the glass cloth satisfy many electrical insulation application requirement. CGS have glass cloth tapw coated with different adh
Technical Library | 2015-03-12 18:26:16.0
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.
Industry Directory | Manufacturer
Hi-Rel Thick Film Substrates, Multilayer, Thru-Hole/Edge Around, 2mil Lines Etched Conductors
8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2
Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
New Equipment | Fabrication Services
PentaLogix offers three PCB fabrication services: US QuickTurn Prototype PCB Includes full Smart DFM design check US made high-quality circuit boards FAST turn times: 2-layer in 1-2 days, 4-6 layer in 2-4 days Tin lead HASL or OSP RoH
The heat resistance and dielectric strength of polyimide tapes make them an excellent choice for high temperature masking and electrical insulation. CGS has different thickness polyimide coated with silicone. CGS can offer different width such as
