Pletronics Inc. manufactures hybrid clock oscillator modules. Pletronics is currently sampling 5mm x 7mm PECL devices and will soon have LVDS samples ready for shipment.
MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.
New Equipment | Coating Equipment
Nozzles Automatic Cleaning Device Conformal Coating Machine with Coating Scope L580*W580mm Technical parameter Model CWCC-3.3L External Size L*W *H 1010*1360*1675mm(L*W*H) Weig
New Equipment | Coating Equipment
Conformal Coating Machine Application: PCBA surface coating, dam process, coating solder mask, DIP components fixing. Conformal Coating Machine Technical Parameter Model CWCC-3L External Size L*W *
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip(90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (ordiagonal Long 47m) Feeder number: up to 120 (using
Used SMT Equipment | Flexible Mounters
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
Industry News | 2024-05-06 10:28:58.0
Recognized at the Productronica China tradeshow, the SL-1040 elevates coating performance with improved yield and uptime for automotive electronics reliability
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
55971 | https://www.ascen.ltd/ASCEN-smt-conveyor-list-0.pdf
ASCEN Technology
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
sizes and pitches are listed in Table 2 together with the Practical Components part numbers. 166 Table 2. Components Characteristics Part Size Pitch Part Number BGA56 6x6 mm 0.5 mm A-CABGA56- .5mm-6mm-DC BGA256 17x17 mm 0.8 mm A-CABGA256- 1.0mm-17mm- DC
