Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Greenmil offers :- PCB DESIGN,PCB FABRICATION, PDB ASSEMBLY,COMPONENT PROCUREMENT
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Sat Sep 22 01:30:31 EDT 2007 | mika
I am sorry my friend, but I can't recall that specific error number. But it would help if you explain a little bit more about your problem. Remember that an error code Do Not necessary points to a direct root-cause of a problem. First of all we nee
Electronics Forum | Wed May 20 05:50:08 EDT 2020 | tima
Hello colleagues, Question. Who ever done 4 mil (100uM) electro conductive epoxy dispensing? is it even possible? I did 6 mil but very unstable results... Now I need 4 mil for an application.
Used SMT Equipment | Pick and Place/Feeders
(4) Universal Instruments GSM2 Pick and Place Machines in Good Running Condition Machines are complete and come with Feeder Carts and Feeders Machine 1 - Model Number: GSM2 - Dual Beam - Q Block - (2) 7 Spindle FlexJets - (2) 2.6 mil upper lookin
Used SMT Equipment | X-Ray Inspection
Details: • Software IA 4.0.10.0 MIL6 • System Version 5.0 Analyzer • Tube: 160kv (Transmissive tube) • 220 Vac, 60 HZ,10 Amps • Tilt/Turn Arm Condition: Complete & O
Industry News | 2010-04-23 22:02:25.0
BANNOCKBURN, Ill., USA, IPC — Association Connecting Electronics Industries® announces the election of Mel Parrish, FSO and director of training materials, STI Electronics Inc., to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
Industry News | 2020-11-13 17:10:59.0
IMI, Inc. has successfully completed an intensive audit to IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements and has earned a Qualified Manufacturer's Listing (QML) under IPC's Validation Services program.
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Parts & Supplies | Other Equipment
AI universal parts 40727505 46737003 SCRAP HOUSING ASSY, OFFSET 46737103 SCRAP HOUSING ASSY, "T" STYLE 46750601 COVER, CLINCH OFF 46750901 COVER, CLINCH VSL 46757801 PICKER AXIS MTR ASSY 46757901 X AXIS MTR ASSY 46758001 Y AXIS MTR ASSY 467
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2015-03-12 18:26:16.0
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.
Make: Universal Instruments Model: Advantis 4982C Vintage: 2006 PEC Camera Single Beam Advanits – Lead Screw FlexJet 7 Spindle Head with 2.6 mil Camera Condition: Complete & Operational Location & Shipping: Nashua, NH / FOB Origin A
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | Garland, Texas USA | Sales/Marketing
Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business
Career Center | Fort Lauderdale, Florida USA | Production
Manufacturing / SMT Process Engineer ESSENTIAL DUTIES & RESPONSIBILITIES include the following. Others may be assigned. � Conceive, develop, document, and implement manufacturing processes for PCB assembly � Creates and maintains process instruc
Career Center | Fallbrook, California USA | Sales/Marketing
I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
) Bumped components 80 mm (3.1”) 0.15 mm (6 mil) 0.08 mm (3 mil) VISION CAPABILITY SOFTWARE MODULES (OPTIONAL) Shared databases Line mode PCB ID (2D barcode
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» PCB Support Systems » Page 6 PCB Support Systems ezLOAD 120 ezLOAD 40 ezLOAD Flex ezLOAD Replacment Pads Showing 61–72 of 137 results ` Default sorting Sort by popularity Sort by latest Sort by price
