Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
Technical Library | 2021-09-08 13:43:56.0
Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Black Durostone alternative for selective solder pallets Overview: Black Durostone alternative is made from anti-static black composite material and reinforced fiberglass. Properties: 1, Its excellent machining properties enabling
High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r
Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
ERW Steel Pipe (Electric Resistance Welded Pipes), EFW 1. Size: OD: 10.3-610mm / WT: 1.65-22mm, 2. Standard: API 5L, ASTM A53, EN10217, BS1387-85, GB/T3091-2001 3. Material: GR.B, X42,X46,X52,X56,X60, S235, Q345, S355JRH, ST37, ST52 4. Leng
SPIRAL WELDED STEEL PIPE SSAW(spiral submerged-arc welded pipe) 1. Size: OD: 219mm-3120mm / WT: 3.2-40mm 2. Standard: API 5L, ASTM A252, SY/T5037, DIN2458, EN10025 3. Material: GR.B, ST37, ST52, X42,X46,X52,X56,X60, Q235, Q345 4. Length: 6
ERW Steel Pipe (Electric Resistance Welded Pipes), EFW 1. Size: OD: 10.3-610mm / WT: 1.65-22mm, 2. Standard: API 5L, ASTM A53, EN10217, BS1387-85, GB/T3091-2001 3. Material: GR.B, X42,X46,X52,X56,X60, S235, Q345, S355JRH, ST37, ST52 4. Leng
