SMT Samsung 12mm embossed for SM series pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER SAMSUNG S
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
Electronics Forum | Tue Sep 15 14:17:56 EDT 1998 | Frank S
I am thinking of purchasing a Panasonic MV series chipshooter. If you own a Panasonic MV machine I would like to hear what you like and dislike about it. Is the service good? Are spare parts readily availiable? Does Panasonic support and follow up o
Electronics Forum | Thu Sep 17 17:21:55 EDT 1998 | aa
| I am thinking of purchasing a Panasonic MV series chipshooter. If you own a Panasonic MV machine I would like to hear what you like and dislike about it. Is the service good? Are spare parts readily availiable? Does Panasonic support and follow up
Used SMT Equipment | Chipshooters / Chip Mounters
Hello and thank you for your interest in our (2) FUJI CP43 and (1) FUJI IP3 Machines For Sale. These(3) machines are being sold together in package. The equipment just came out of a Military Defense Electronics Manufacturing Company. It is in good co
Used SMT Equipment | Pick and Place/Feeders
Hundreds of Quad feeder overstock. Prices 8mm 5 volt NON IQ $75.00 8mm - 12 Volt IQ $125.00 16mm -IQ $150.00 24mm - IQ $200.00
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
Industry News | 2017-10-02 13:58:42.0
GPD Global will exhibit at the upcoming IMAPS 2017. At booth 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.
Parts & Supplies | SMT Equipment
Smt Fuji GL series machine nozzles used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozzle 3.
Parts & Supplies | SMT Equipment
Smt Fuji GL series machine nozzles used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozzle 3.
Technical Library | 2014-07-17 17:01:10.0
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
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Argo EMS is a well-established and growing electronics assembly shop. We are seeking an SMT pick and place machine operator. Training is available for enthusiastic quick learners with a positive attitude. Higher salary for experience programmin
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