Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2014-08-18 10:23:40.0
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Industry News | 2009-11-02 21:58:24.0
OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.
Industry News | 2013-05-13 15:06:06.0
AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2007-12-05 22:55:10.0
OSAKA, JAPAN � December 4, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth EAST6 59-18 at the upcoming Internepcon Japan exhibition, scheduled to take place January 16-18, 2008 at the Tokyo Big Sight Exhibition Center, Japan.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
