Technical Library | 2012-02-16 16:53:16.0
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
Used SMT Equipment | In-Circuit Testers
Ando AQ6315E Optical Spectrum Analyzer The AQ6315E optical spectrum analyzer (OSA) is an improved version of the well known Ando AQ6315A. This OSA can do spectrally resolved intensity measurements in the range of 350 to 1750 nm with a wavelengt
Standard Silicone-Base Thermal Pads Qoolite – Cool Provide (SPVS) Flame resistant, high performance thermally conductive sheet Silicon Free Thermal Conductive Sheet Featuring Electromagnetic Wave Absorption Properties. High thermal conductiv
Plastlist FR glass epoxy is a popular and versatile high pressure thermo set plastic laminate grade with good strength to weight ratios. With near zero water absorption Plastlist FR is most commonly used as an electrical insulator possessing consider
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New Equipment | Cleaning Equipment
description 1. Esocoo is made of high-quality woodpulp polyester spunlaced nonwovens 2. Prime cleaning performance 3. Excellent absorption with water and solvent 4. Lint-Free and no scratch to printer surface 5. High tensile strength MINAMI, DEK, MPM
Technical Library | 2022-01-05 23:14:20.0
The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.
Product Name: DEK Stencil Paper Roll Part No:HT16-DEK core id: 20mm core length: 530mm paper width: 250mm, 300mm, 350mm, 400mm, 405mm, 450mm, 490mm, 510mm, 515mm,. paper length: 9m, 10m, 11m, 12m. Qty:1roll/pc Color: White The standard sepc
Product Name: MPM Stencil Paper Roll Part No:HT16-MPM core id: 19.5mm core length: 455mm, 457mm paper width: 250mm, 300mm, 350mm, 440mm, 443mm, 445mm, 450mm. paper length: 9m, 10m, 11m, 12m. Qty:1roll/pc Color: White The standard sepcifica
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