Industry Directory | Consultant / Service Provider
DCD is a leading IP Core provider and SoC design house. The company was founded in 1999 and since the early beginning is considered as an expert in IP Cores architecture improvements.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz SMX Signal Generator 100 kHz to 1 GHz channel frequency: 100kHz - level of performance 1000MHz RF power splitter -137 to +13 dBm Frequency: 10Hz AM / FM modulation and minimum pulse Interface d'IEEE Interface IEEE - See more at:
Used SMT Equipment | In-Circuit Testers
The Agilent Mini-OTDR is the best selling product in Agilent's portfolio of Optical Network Test Solutions for the installation, maintenance and operation of fiber networks. The Mini-OTDR is designed to provide its users with the fastest tool avail
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 70902A IF Section Module, 10 Hz to 300 kHz The Agilent-Hp 70902A IF Section is a 1/8-width module, providing a resolution bandwidth of 10 Hz to 300 kHz, designed for use in a 70000 Series Modular System. The module processes a
Industry News | 2013-11-05 22:47:45.0
ADLINK Technology invites attendees to visit Booth 254 of Hall A1 from November 12 - 15 at productronica 2013 in Munich, Germany. ADLINK is showcasing our exciting measurement and automation products, meeting application and customer needs with USB DAQ dynamic signal acquisition modules, high-speed and high-resolution digitizers, and PXI Express controllers and platforms.
TEXAS INSTRUMENTS 2493619-0001 ADAPTER BASE TEXAS INSTRUMENTS 305-25N 115VAC INPUT TEXAS INSTRUMENTS 560-2124 120VAC CHASSIS TEXAS INSTRUMENTS 0943679-0001 PWR SUPPLY 960B TEXAS INSTRUMENTS 0983801-0003 SILENT 700 TERM TEXAS INSTRUMENTS
Used SMT Equipment | In-Circuit Testers
Agilent N4694A Agilent/HP N4694A Electronic Calibration Module, 10 MHz to 67 GHz, 1.85 mm, 2-port The Agilent N4694A MW electronic calibration (ECal) module makes calibration of vector network analyzers fast, easy and accurate. The RF ECal syst
22510 PART 22705 PART 10114KX PCB ASSEMBLY 10115BP PCB ASSEMBLY 101-4 RACK CONSOTROL FLUSH MOUNT 4UNIT MOUNTING 111-A INDICTAOR 111-A-L INDICTAOR PNEUMATIC CONSOTROL HIGH-LOW ALARM LIGHT 121003D D ETECTOR 122-FE RECORDER 2PEN PNEUMATIC PROCES
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