Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Industry News | 2003-06-09 09:41:14.0
Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Parts & Supplies | Pick and Place/Feeders
Seal, interface P+P-module
Parts & Supplies | Pick and Place/Feeders
Module: head interface HF cpl.
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