Industry News | 2019-02-15 05:28:59.0
STMicroelectronics announced the integration of machine learning technology into its advanced inertial sensors to improve the motion tracking performance and battery life of mobile phones and wearables.
and MEMs lid-attach technology, it is becoming increas
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
. The improved adhesion increases package reliability. MEMS - MEMS devices such as accelerometers, roll-over sensors and air bag deployment sensors require advanced plasma treatments during their manufacture in order to improve the device yield and long-term reliability
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
winsouce.jpg)
