New SMT Equipment: acceptable criteria for solder ball (1)

Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing

Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing

New Equipment | Rework & Repair Equipment

Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing  WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main u

Shenzhen Wisdomshow Technology Co,Ltd.

Electronics Forum: acceptable criteria for solder ball (39)

Flux dip or solder print for CSP

Electronics Forum | Tue Jan 31 09:10:04 EST 2017 | Rob

Hi Joshua, We've done both, but a lot depends on what soloution your machine vendor has, and how good it is. Can you add it into your machine acceptance criteria? Rob.

Re: Void in solder bump

Electronics Forum | Fri Jan 15 08:11:34 EST 1999 | Jim Nunns

Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK Regards Jim |

Industry News: acceptable criteria for solder ball (30)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Videos: acceptable criteria for solder ball (6)

A brief demonstration showing the 2014 YESTech FX operating

A brief demonstration showing the 2014 YESTech FX operating

Videos

This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com

Capital Equipment Exchange

What it Takes for IPC-A-610 Certification Training

What it Takes for IPC-A-610 Certification Training

Videos

This video describes what it takes to bring IPC A-610 training inside of a company. The list of things that need to be in place includes: a trained instructor, IPC-A-610 slide deck for training, a projector, standards for all participants and a perso

BEST IPC Training

Training Courses: acceptable criteria for solder ball (3)

Certified IPC Specialist (CIS) Course IPC/WHMA-A-620 with Supplemental Hands-On "Requirements and Acceptance for Cable and Harness Assemblies"

Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)

The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.

Blackfox Training Institute, LLC

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Express Newsletter: acceptable criteria for solder ball (1020)

Partner Websites: acceptable criteria for solder ball (215)

IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs

IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Atta

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member

Surface Mount Technology Association (SMTA)


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