Industry Directory: acceptance criteria solder balls (2)

BEST Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Scotle Technology Group Limited

Industry Directory | Manufacturer

Scotle Founded in 2006,a manufacturer for Scotle BGA rework stations, and other SMD rework accessories. Scotle accept OEM and ODM worldwide. Top quality, best service is always the persuit of Scotle.

New SMT Equipment: acceptance criteria solder balls (17)

IPC Certification

IPC Certification

New Equipment | Education/Training

IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce

Blackfox Training Institute, LLC

IPC-A-610D - Acceptability of Electronic Assemblies - 1 Day Classes

New Equipment | Education/Training

This latest version D of the IPC-A-610 released in  Released February 2005,  Presented in a one day class this is a must for all quality assurance and assembly departments.  IPC-A-610D illustrates industry-accepted workmanship criteria for electronic

Precision PCB Services, Inc

Electronics Forum: acceptance criteria solder balls (264)

QFN (LPCC) acceptance in Asia

Electronics Forum | Fri Jun 20 09:38:56 EDT 2003 | caldon

Hi John- First, I do not have first hand experience so my input is pure theory. This type of package (in Some Cases) has a center grounding bonds and leadless legs ups the difficulty tremendously. With no stand-off from the Balls(or Legs) when the so

Leadless(passives) solder joint criteria

Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner

We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr

Used SMT Equipment: acceptance criteria solder balls (15)

Air-Vac PCBRM-12 Solder Fountain

Air-Vac PCBRM-12 Solder Fountain

Used SMT Equipment | THT Equipment

The most cost effective solution for Thru-Hole selective soldering & desoldering. Includes foot switch Solder included This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully function

Capital Equipment Exchange

Cyberoptics Flex 18

Cyberoptics Flex 18

Used SMT Equipment | AOI / Automated Optical Inspection

Large board AOI for any inspection (solder paste, post placement, post reflow) This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional for your live or video acceptance. If you requi

Capital Equipment Exchange

Industry News: acceptance criteria solder balls (90)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Technical Library: acceptance criteria solder balls (4)

Inclusion Voiding in Gull Wing Solder Joints

Technical Library | 2012-08-30 21:24:29.0

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications.

IBM Corporation

Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints

Technical Library | 2023-09-26 19:14:44.0

The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.

Auburn University

Videos: acceptance criteria solder balls (141)

3D SPI manufacturer

3D SPI manufacturer

Videos

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用

CNSMT CO.LTD

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

Training Courses: acceptance criteria solder balls (284)

IPC J-STD-001 Trainer (CIT) Recertification Course

Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.

The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.

Blackfox Training Institute, LLC

Certified IPC Specialist (CIS) Course IPC/WHMA-A-620 with Supplemental Hands-On "Requirements and Acceptance for Cable and Harness Assemblies"

Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)

The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.

Blackfox Training Institute, LLC

Events Calendar: acceptance criteria solder balls (2)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

IPC-A-610

Events Calendar | Mon Jan 29 00:00:00 EST 2018 - Mon Jan 29 00:00:00 EST 2018 | Rolling Meadows, Illinois USA

IPC-A-610

BEST Inc.

Career Center - Jobs: acceptance criteria solder balls (2)

Material Lab Technician

Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin

Winslow Automation (aka Six Sigma)

SMT Process Engineer

Career Center | Huntington Beach, California USA | Engineering

Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities

TRANTRONICS, INC.

Express Newsletter: acceptance criteria solder balls (1020)

Partner Websites: acceptance criteria solder balls (174)

Ball Shear Solder Ball Shear | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=11

. Solder balls are sheared individually with a tool aligned at an accurate position above the device’s surface and the force measured throughout the test

ASYMTEK Products | Nordson Electronics Solutions

New 2016 Solder Joint Goals - PCB Libraries Forum - Page 1

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/new-2016-solder-joint-goals_topic1921.html

. This new incremental solution to customizing solder joint goals based on this new criteria, reduces pad and courtyard sizes across all component families and increases PCB real-estate by 10 – 20

PCB Libraries, Inc.


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