Industry News | 2014-07-16 20:05:16.0
Backward Compatible G4C Ceramic Hot Bars Designed for Legacy TC-1000 and TC-1200 Toddco Temperature Controllers
Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Electronics Forum | Mon Jul 22 05:01:42 EDT 2002 | Comrade
Can anybody highlight the risks of implementing ACF bonding other than it is expensive and difficult to perform ??
Electronics Forum | Fri Sep 25 00:39:31 EDT 2015 | jana
Does anyone use bonding with ACF( anisotropic conductive film)?
Electronics Forum | Mon Jul 22 08:27:51 EDT 2002 | davef
Look here; http://www.unitekeaprosystems.com/res_tech/pdf/HDHBCWAB.pdf ACF Bonding. Anisotropic Conductive Film / Anisotropic Conductive Foil Bonding.
Electronics Forum | Tue Mar 03 09:37:54 EST 2015 | capse
Hot bar soldering or hot bar bonding with ACF is widely used for your applications. A company I represent can assist you; Fancort Industries.
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Wed Jun 24 21:32:07 EDT 1998 | Jon Medernach
Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chi
Electronics Forum | Thu Jun 25 08:24:13 EDT 1998 | Earl Moon
| Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip C
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