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MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Industry News | 2021-03-31 17:56:27.0

MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-06 04:53:14.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-10 11:09:50.0

MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Industry News | 2020-11-03 13:18:05.0

MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

MacDermid Alpha Electronics Solutions

KappZapp3.5R Rosin-cored Solder

KappZapp3.5R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp3.5R Rosin-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains a Rosin flux. When the solder is heated, the flux is released and removes the oxide c

Solder Direct

KappZapp7R Rosin-cored Solder

KappZapp7R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c

Solder Direct

PV Ribbon

PV Ribbon

New Equipment | Solder Materials

During our more than 30 years serving in solder materials with solid R&D and total solution capabilities, Solarjoin delivers the best quality of PV Ribbon and Flux to meet your high reliability requirements. BASE METAL OPTIONS of PV Ribbon: Basic

Shenmao Technology Inc.

Zhuhai Camtech Circuit Co., Ltd

Industry Directory | Manufacturer's Representative

Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p

Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards

Technical Library | 2018-05-09 22:15:29.0

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.

iNEMI (International Electronics Manufacturing Initiative)

Copper Oxide

New Equipment |  

Pan-Continental (H. K.) Limited. Fax: 886-4-26811523 Tel: 886-4-26819543 Email: pcc01@zinc.com.tw Dir Sir, 04Mar2002 Re: Copper Oxide We can offer CuO as the following spec., which suitable for electronic area expecial PCB industr

Pan-Continental ( H. K. ) Limited


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