Industry Directory | Manufacturer
Designer and Manufacturer of Acoustic Microscopes for Non-destructive Ultrasonic Immersion Inspection and Semiconductor Package Failure Analysis.
Industry Directory | Manufacturer
PVA TePla Analytical Systems, a company that designs and manufactures advanced Scanning Acoustic Microscopes for both laboratory and production environments
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
ERI brings training to your facility. We "tailor" that training to the host firm's needs. A few courses are listed at http://www.equipment-reliability.com/course_outlines.html, but you can also download a PDF version with a complete list of our cours
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Manufacturer's Representative
HW Technologies provides the very latest technical solutions for Australian industry. Through our contacts in Europe and the USA, we are able to source and advise on customised solutions for acoustic, electronic testing and production needs.
Industry Directory | Consultant / Service Provider
Global Compliance telecom test equipment provides protocol testing and compliance testing for development, debugging and R&D testing. Analog PSTN (PESQ), E1, T1, ISDN PRI, xDSL, VoIP/SIP, WCDMA/GSM/3GPP, Bluetooth, WI-FI and Acoustic testing
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Used SMT Equipment | In-Circuit Testers
Agilent 6653A The 6653A Power Supply is rated at 35 V @ 15 A and features: HP-IB Linear Output Regulation Complete Front Panel Control Calibration and Display Fan-speed control to minimize acoustic noise Low ripple and noise Over-voltage and over
