Full Site - : activation temperature (Page 11 of 73)

KYZEN Offers Tips for Improving Device Reliability at the SMTA Intermountain Expo

Industry News | 2015-04-07 17:14:44.0

KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.

KYZEN Corporation

M300 10Amp power connector for high reliability applications

M300 10Amp power connector for high reliability applications

Videos

Demand for a power connector system has arisen in a number of high-reliability markets that require durability, high performance and extreme temperature tolerance in the 5-10 Amp range. Harwin’s M300 series connectors meet these reqirements, with cab

HARWIN

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Indium Corporation Introduces Liquid Flip-Chip Flux

Industry News | 2022-03-09 12:32:53.0

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.

Indium Corporation

TTC100C - Lead Free Tip Tinner

TTC100C - Lead Free Tip Tinner

New Equipment | Solder Materials

Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic

FCT ASSEMBLY, INC.

Robotic Soldering eBook from Bob Willis

Industry News | 2023-05-01 14:29:08.0

The Robotic Soldering, Inspection & Defect Guide is the latest free process guide produced by Bob Willis

ASKbobwillis.com

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper using KappAloy Solder

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper using KappAloy Solder

New Equipment | Solder Materials

Kapp Golden Flux has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting o

Solder Direct

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

New Equipment | Solder Materials

Kapp Golden Flux™ has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux™ is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting

Kapp Alloy & Wire, Inc

Piezobrush – cold-active hand-held atmospheric-pressure plasma device

Industry News | 2009-12-08 14:33:47.0

The compact, portable handset for cost-effective plasma surface activation.

Reinhausen Plasma GmbH

New Lower Temperature Heat Shrink Dual Wall FEP/THV Fluoropolymer Tubing

Industry News | 2019-05-08 10:34:17.0

Low Shrink Temperature Dual Wall FEP/THV is a new Dual Wall Fluoropolymer product that has been modified to have a lower shrink temperature and still provide all the excellent benefits of Fluoropolymer Tubing.

Tef Cap Industries Inc.


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