Contract Manfacture, Design to Production, PWB assemblies (smt & thd), cables & harnesses, custom te
Adam Finnieston CPO, LPO is a third generation Prosthetist Orthotist.
New Equipment | Industrial Automation
IPSYS01 IPMON01 INNIS11 INNIS21 INNPM12 IEPAS02 INICT03AINFI90 IEMMU11 IMHSS03 IMMFP12 IMFEC12 IMASI13 IMASO11 P-HA-RPS-PEP11013 IMDSI22 IMDSI12 IMDSI14 IMDSO14 IMASI23 INICT12INFI90 NTCL01 P-HA-RPS-32200000 PHCBRC10000000 P-HA-RPS -32000000 NK
New Equipment | Industrial Automation
SANDY.[MAILTO:UNITY@MVME.CN] SANDY.[WHATSAPP/SKYPE/MOBILE:+8618020776786] SANDY.[QUOTE TO YOU WITHIN THE SHORTEST POSSIBLE TIME WITH OUR BEST PRICE] WARRANTY: UP TO 12 MONTHS SHIPPING: FAST DELIVERY IS AVAILABLE NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Thu Jun 14 08:49:36 EDT 2001 | adam
I'd like to know what advantages are there to use silver emerge PCB's. Currently we are using HASL boards, and we are having problems especially using BGA connectors. Any help will be appreciated. Adam.
Electronics Forum | Tue Nov 07 08:09:19 EST 2000 | adam
WE are using press fit connnectors on a range of boards, one of which is posing me a few process questions . The Machine is a fully automatic machine. The problem is intermittent and I can't seem to put a finger on it. An array of connectors ( consi
Industry News | 2019-06-30 20:50:39.0
In recognition of his ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries® bestowed a Dieter Bergman IPC Fellowship Award upon David Adams, Collins Aerospace, at IPC SummerCom on June 17.
Industry News | 2019-08-08 22:35:07.0
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International 2019. Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
Parts & Supplies | Fume Extraction
Get in Touch with us Sales Manager: Leonia Email: sales11@amikon.cn Whatsapp/Moblie: +86-18030175807 Skype/Wechat: 18030175807 QQ: 285119548 Packing&Delivery Warranty: 12 months. Lead time: 1-2 working days. Term
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Fri Sep 28 00:00:00 EDT 2018 | Lyon, France
IPC/WHMA Cable and Wire Harness Assemblies Conference
Career Center | Yishun, Singapore | Maintenance
To : Sir/Madam Subject: Apply for Job Dear Sir/ Madam, I write to enquire if there is a vacancy for a SMT Maintenance Engineer in your firm.I am 40 years old a permanent resident of Singapore with an IC # S6863162i and i'm still work
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ADAMTECH&PN=MDPC-S-RA
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Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/keynote.cfm
: A True Story of Teamwork, Leadership and High Stakes Innovation Adam Steltzner, NASA Tuesday, September 24 | 9:00am - 10:00am | Room 21/22 FREE to All Attendees
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