In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Industry News | 2014-05-31 13:05:49.0
Kyzen announces plans to exhibit in Booth #5752 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2011-01-06 12:47:12.0
STI Electronics, Inc. announces that Ray Cirimele has joined its Training Services staff.
Industry News | 2009-04-23 20:46:52.0
FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
Industry News | 2019-01-17 20:40:01.0
Speedprint Technologies will use the APEX Expo to promote its range of screen printer platforms that address solder paste printing and dispensing for boards and substrates from the very small to the very large. With the addition of two large board printers in the past year, Speedprint now offers a comprehensive product portfolio to address any surface mount application.
Industry News | 2010-01-13 19:55:42.0
SOUTH AYRSHIRE, SCOTLAND — January 2010 — Etek Europe, a leading supplier of products and services to the European electronics industry, announces that it now represents Den-On Instruments Co. Ltd.’s RD-500III series of Hot Air Rework Stations throughout Eastern Europe.
Industry News | 2008-03-20 16:08:23.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV
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