Full Site - : adding and solder and to and bga (Page 12 of 17)

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Christopher Associates/Koki Solder to Present Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes at SMTAI 2010

Industry News | 2010-09-29 23:32:58.0

Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Industry News | 2020-08-22 04:19:37.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions

VJE’s Don Naugler and BEST’s Bob Wetterman to Present during Technical Session SMT3 at SMTA International 2013

Industry News | 2013-09-16 14:38:01.0

VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.

VJ Electronix

Christopher Associates to Display Advanced Equipment and Materials at the SMTA LA/Orange County Expo & Tech Forum

Industry News | 2011-10-07 22:45:45.0

Christopher Associates will showcase equipment and materials from its world-class suppliers at the upcoming SMTA LA/Orange County Expo & Tech Forum on November 2.

Christopher Associates Inc.

KIC to Showcase the ProBot at the IPC APEX EXPO KIC’s ProBot Automatic Profiling System complements AOI and X-ray Inspection

Industry News | 2014-02-17 20:20:58.0

IC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system in Booth #1336 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

KIC Thermal

Christopher Associates to Display Advanced Equipment and Materials at the SMTA Wisconsin/Great Lakes Expo & Tech Forum 2011

Industry News | 2011-10-25 00:34:52.0

Christopher Associates Inc. will showcase equipment and materials from its world-class suppliers at the upcoming SMTA Wisconsin/Great Lakes Expo & Tech Forum.

Christopher Associates Inc.

Meet STI Electronics, Inc. at the 2012 IPC APEX Expo to Learn About its Training and Engineering Services

Industry News | 2012-01-17 15:52:01.0

STI Electronics will feature its key products and services in Booth #2921 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

STI Electronics


adding and solder and to and bga searches for Companies, Equipment, Machines, Suppliers & Information