Industry News | 2013-10-21 16:05:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
New Equipment | Rework & Repair Services
STI has qualified technicians trained in IPC 7711/7721, as well as in custom design solutions, to address your electronic rework and repair needs. STI’s services encompass both mainstream assembly technologies (surface mount and through-hole) as well
New Equipment | Rework & Repair Equipment
We are manufacturer for X-ray inspection machine X-ray counter BGA rework station Contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli Email:sales11@zhuomao.com.cn xbox360 b Product Description Specific
New Equipment | Assembly Services
Molex New and Original 68151-2025 in Stock IC Connector package 68151-2025 Board Connector, 20 Contact(s), 2 Row(s), Male, Right Angle, 0.098 inch Pitch, Solder Terminal, Guide Slot, Gray Insulator, Receptacle 178303
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Industry News | 2013-03-25 15:21:46.0
OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
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