Industry News | 2012-07-26 14:56:08.0
VJ Electronix, Inc. announces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology” symposium hosted by BEST, Inc.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2012-04-19 09:00:53.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 21:36:12.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
Industry News | 2012-04-24 06:53:22.0
April 24, 2012.Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.
Industry News | 2012-04-24 08:13:12.0
April 24, 2012 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.
Industry News | 2008-03-05 22:38:31.0
OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.
Industry News | 2014-08-27 21:23:28.0
STI Electronics, Inc. announces that it will exhibit in Booth #412 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2016-10-06 10:10:53.0
Digicom Electronics now generates its own nitrogen to use in its solder reflow, selective soldering, and hand soldering manufacturing processes to strengthen the bonds and improve solder adhesion. Adding nitrogen minimizes device failure and ensures printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries. The addition of nitrogen is part of Digicom's Diamond Track Manufacturing Processes.
