Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
West Coast Magnetics serves global leaders in the medical, defense, and many more industries.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Education/Training
An 8 hour combined lecture, video and hands on session that includes: Soldering techniques for soldering wires to terminals including through-hole components. Identify the different types of solder terminals, connectors, and through hole compone
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Electronics Forum | Thu Apr 05 12:25:01 EDT 2001 | davef
Talk about bucking the trend!!! OK, OK, I know some US military work still requires RMA. You�re both correct. Cleaning decisions for RMA fluxed boards are based on customers requirements. [Some do (clean) and some don�t.] Older US military speci
Used SMT Equipment | Soldering Equipment/Fluxes
2008 Vitronics Soltec 6747 Selective Solder Machine Approx Dimensions: 12' x 61" x 72" Location: Jasper, IN USA Serial: _0806867501 Features: o Machine is standard equipped o Added Solder Level Control (Dial Indicator)
Used SMT Equipment | Soldering - Selective
New Vitronics ZEVAv Selective Soldering Machine for Sale in Bolton, UK. Never installed to the prouction line. Features include: • Dual Flux Heads for faster Cycle Times • 3 Preheater Stations with Closed Loop Functionality (2 x Top
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Flux Collection and Self-Clean Technique in Reflow Applications Flux Collection and Self-Clean Technique in Reflow Applications The flux management system for a reflow oven is highly critical to the quality, cost, and yield of a reflow process
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
