Welcome to this Bob Willis Defect of the Month video on BGA inspection, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there
New Equipment | Test Equipment
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates
TI New and Original LMZ31710RVQ in Stock IC QFN42, 2021+ package LMZ31710RVQ 2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338N-B-GM QFN TI 21+
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Industry News | 2017-05-01 15:30:04.0
PDR is pleased to announce that Horizon Sales will discuss the IR-E6 Evolution XL rework system at the SMTA Michigan Expo & Tech Forum, scheduled to take place Thursday, May 11, 2017 at the Crossroads Conference Center in Grand Rapids, MI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S. The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
Industry News | 2021-08-02 12:55:28.0
Additional assembly and production staffing has been added to provide increased support to our growing customer base.
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