One of Europe�s first address for tested and refurbished test- and communication equipment
Design and Manufacture of Voice Evacuation and Public Address Equipment
New Equipment | Design Services
ACI maintains a proven track record of assisting Department of Defense program acquisition offices in the identification and solution of manufacturing technology issues affecting major weapons, aviation, and shipboard systems. Our staff of engineers
New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
Electronics Forum | Sat Jun 13 11:04:12 EDT 1998 | Earl Moon
To those interested, I have had to change back to my long distance ISP address because my local affiliate has problems. My new address is pod@ix.netcom.com (again) while in Michigan and my phone number remains 734-654-0981 Thanks, Earl Moon
Electronics Forum | Sat Jun 13 15:55:46 EDT 1998 | Earl Moon
| To those interested, | I have had to change back to my long distance ISP address because my local | affiliate has problems. | My new address is pod@ix.netcom.com (again) while in Michigan and my phone number remains 734-654-0981 | Thanks, | Earl Mo
Used SMT Equipment | Semiconductor & Solar
Yamaha YS24 SMT mahcine Model YS24: (Note: high-speed machine) Object substrate： L50 x W50mm to L700 x W460mm Mount capacity： 72,000CPH (0.05s /CHIP: our best condition) Mounting accuracy： ±0.05mm(μ+3σ), ±0.03mm(3σ)
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | Assembly Accessories
KLA-M4209-000 SYSTEM UNIT ASSY YS series system card YS12 YG12 YangYingLong Sales Manager for SMT machines and accessories Accountant :DONGGUAN KINGSUN Automation Technology Co.,LTD Tel:0086-0769-3335254 Cell: 0086-13631290171 WhatAPP:+86
Parts & Supplies | Assembly Accessories
Part Name：VALVE A040-4E1-54W PART No：KM1-M7162-11X YangYingLong Sales Manager for SMT machines and accessories Accountant :DONGGUAN KINGSUN Automation Technology Co.,LTD Tel:0086-0769-3335254 Cell: 0086-13631290171 WhatAPP:+86 13631290171 WeChat:1363
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Why you should attend International Wafer-Level Packaging Conference, October 23 - 25, 2018 in San Jose, California, USA.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Apr 25 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Shanghai, China
SMTA China East Conference
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | , Washington USA | Management,Production
Electronic Assembly Supervisor needed to supervise production schedules, production quality and on-time delivery, assign Assembler duties, establish training needs and oversee training, and define Assembler performance standards, review outcome of pe
Career Center | , | Engineering,Production,Technical Support
Electronics equipment manufacturing and distribution company seeks an electrical engineer specializing in automated testing equipment. Familiarity with automated testing equipment required. Experience with ICT (In -Circuit-Test) and flying probe. R
Career Center | Kathmandu, Nepal | Engineering
I have been working from last 4 years in different field and post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat
Career Center | uttam nagar, New Delhi India | Maintenance,Technical Support
CURRICULAM VITAE VIKAS DHYANI Address: E-92,Nanhe Park E-mail: dhyani.vicky@rediffmail.com Uttam Nagar, New Delhi 59 Mo. 8826724457 CAREER OBJECTIVE: Looking forward for a challenging and significant career, to work in profession
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SELECT * FROM email_address WHERE email = '#sender_email#' INSERT INTO email_address (email, type) VALUES ('#sender_email#' , 'unregistered_user_referrer') SELECT * FROM email_address WHERE email = '#sender
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China GOLDLAND ELECTRONIC TECHNOLOGY CO., LIMITED latest company news about GOLDLAND ELECTRONIC Technology has moved to the new address
