Electronics Forum | Mon Oct 27 23:25:56 EDT 2008 | davef
Each thermal cycle decreases the thickness of the OSP. So depending on the material, fabrication method, and blablabla; after one thermal cycle we'd expect the OSP to provide adequate protection for a couple of days. After that, you may need a more a
Electronics Forum | Thu Oct 18 17:53:31 EDT 2012 | bandjwet
We test drove several machines including the Yestech, Omron and Orbotech. For our Proto operations YesTech was about as easy to use as the rest, had adequate resolution and the right speed for the small lot sizes we are involved in.
Electronics Forum | Fri Oct 07 09:00:03 EDT 2011 | blnorman
2D codes take up much less real estate so that might work. Something else we did was to go to CO2 lasers and mark directly into the solder mask. Underlying copper gave adequate contrast to the green mask. Much more of an investment, but works grea
Electronics Forum | Sun May 05 10:36:08 EDT 2013 | mbb
Hello, We are using Panasonic pick and place machine. I would ask if there is anyone from Panasonic to tell us which is the tape splicing method the most adequate to Panasonic feeders?
Electronics Forum | Fri Mar 31 17:13:04 EDT 2017 | dontfeedphils
Clean everything to do with the print process during the switch adequately and you shouldn't have an issue.
Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos
Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi
Electronics Forum | Mon Aug 26 20:31:34 EDT 2002 | davef
Yes, it is quite common. Does it [refraction] provide adequate resolution? => Depends on: * What you mean by �adequate�. * When during the process [cleaning solution life] you make the measurement. Is the [refraction] measurement affected signifi
Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef
Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Tue Jun 06 15:19:39 EDT 2006 | muse95
For some, not all, hand assembly, we use additional flux. We use a flux pen in certain applications and liquid flux in other applications - you can't just say switch to a flux pen, it isn't always adequate. Most flux pens are ORL0 with very low sol
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