Full Site - : adequate when humidity is below 30 (Page 3 of 5)

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c

Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry

Re: solder balling

Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.

If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon

Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean

| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60

Re: BGA repair/rework

Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon

| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting


adequate when humidity is below 30 searches for Companies, Equipment, Machines, Suppliers & Information