Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 18:00:39.0
EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
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