Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Industry News | 2017-03-06 12:46:42.0
Nordson ASYMTEK will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/112921-automated-adhesive-dispensing-system-simplifies-edge-sealing-on-pcb
Automated Adhesive Dispensing System Simplifies Edge Sealing on PCB Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
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) free sample download Status: Active Updated: 5/11/2021 11:44:00 PM Mounting Type: Surface Mount Logical Description: Antenna, Bluetooth, Zigbee, WLAN ISM, Wireless Device Physical Description: Antenna, Chip; 11.00 mm L X 3.00 mm W X 1.40 mm H body Commonly Visited
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