Industry News | 2014-08-03 19:58:55.0
The SMTA announced that the Evolving Technologies Summit will be held on September 29, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.
Industry News | 2012-03-09 17:47:15.0
IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2011-12-07 20:51:57.0
IPC announces the creation of a new IPC Printed Electronics Management Council Steering Committee that will oversee the development of educational programs to support the printed electronics industry.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2013-06-26 14:34:43.0
Nordson ASYMTEK will be hosting live demonstrations of precision coating and jetting processes at SEMICON West 2013. Engineers will be available to discuss equipment, applications, and the manufacturing process.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2021-06-23 06:36:30.0
The relocation expands operations and capabilities for SELECT's selective soldering systems used in electronics manufacturing
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
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