Industry Directory: adhesive staking (1)

Conductive Compounds, Inc.

Industry Directory | Manufacturer

Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.

New SMT Equipment: adhesive staking (1)

EP-837 Two-part Epoxy Staking Adhesive

EP-837 Two-part Epoxy Staking Adhesive

New Equipment | Materials

6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

Electronics Forum: adhesive staking (6)

SMT adhesive printing

Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC

Check IPC-A-610C Chapter 12.1, Staking Adhesive

Making a BGA stand up

Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef

Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during

Industry News: adhesive staking (10)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Technical Library: adhesive staking (1)

Staking/Epoxy Adhesive Dispensing for Aerospace

Technical Library | 2023-08-16 18:48:50.0

One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"

GPD Global

Express Newsletter: adhesive staking (291)

Partner Websites: adhesive staking (66)

eptac_05_19_10.PPT

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf

  Burnt shrink sleeve information added to section. 11 610 Changes   New sections 7.1.8.1 and 7.1.8.2 Connector Mounting   Modified 7.2.2.1. Adhesive bonding   Modified 7.3.5.1 new criteria for vertical fill of plated through holes for Class 2 products


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