Full Site - : adhesives hot melt (Page 12 of 41)

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Industry News | 2019-01-14 19:51:49.0

Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).

Finetech

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

Sono-Tek to Debut SonoDry 1000 Spray Drying System at INTERPHEX 2008

Industry News | 2008-01-31 16:45:57.0

Milton, NY � January 31, 2008 � Sono-Tek Corporation, the world leader in the development and application of ultrasonic atomization technology and spraying and coating application systems, announces that it will introduce the SonoDry 1000 spray drying system in booth 1639 at the upcoming INTERPHEX 2008 exhibition and conference scheduled to take place February 14-15, 2008 at the Puerto Rico Convention Center in San Juan, Puerto Rico.

SONO-TEK CORPORATION

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

Nordson DAGE Showcases 4000Plus Pad Cratering Inspection System at Nepcon Shanghai

Industry News | 2011-05-12 22:13:47.0

Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.

Nordson DAGE

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-115)

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-115)

Videos

The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb

PACE Worldwide

Lead Free Wave Solder Machine E400

Lead Free Wave Solder Machine E400

Videos

Quick Overview Lead Free Best Solution E400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. E400 Lead Free Wave Solder Machine F

1 CLICK SMT TECHNOLOGY CO., Limited

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

Lead Free Wave Solder Machine E400

Lead Free Wave Solder Machine E400

New Equipment | Wave Soldering

Quick Overview Lead Free Best Solution E400 is a CE certificated compact Lead Free Wave Solder Machine with inline finger conveyor, stepper driven spraying fluxer, hot air preheat zone & Ti dua wave solder pot. E400 Lead Free Wave Solder Machine F

1 CLICK SMT TECHNOLOGY CO., Limited


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