Full Site - : adhesives hot melt (Page 5 of 40)

Krayden Inc. to Showcase Suppliers' Technologies at ATExpo

Industry News | 2008-09-15 16:44:29.0

DENVER � September 2008 � Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from its industry-leading suppliers at the upcoming ATExpo in booth 2318. ATExpo is scheduled to take place September 23-25, 2008 at the Donald E. Stephens Convention Center in Rosemont (Chicago), IL.

Krayden Inc.

Krayden, Inc. Introduces Expanded New Line Card for 2009

Industry News | 2009-04-08 16:12:41.0

DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.

Krayden Inc.

hot melt system

hot melt system

Videos

Application product: straight line box, crash lock box, 4 & 6 corner box, hamburger box, folding, etc Model: KPM-PJ-V24 Controller model: HZ4 Pump model: HB6 Head :1-4pcs; 1-8pcs Input power :AC220V 50-60Hz Air pressure request: 6 bar Adhesive viscos

DONGGUAN KEQI AUTOMATION EQUIPMENT CO.,LTD

Koki Company LTD

Industry Directory | Manufacturer

Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.

New Technomelt® Material Streamlines Substrate Coating Processes

Industry News | 2016-03-27 14:19:07.0

Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.

Henkel Electronic Materials

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Technical Library | 2007-11-01 17:16:07.0

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,

i3 Electronics

Krayden Debuts Dow Corning Solar Solutions’ Solar Junction Box and Frame Sealing Using Reactive Silicone Hot Melts

Industry News | 2010-06-04 17:32:40.0

DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, introduces Dow Corning Solar Solutions’ PV InstantSeal. This silicone reactive hot melt supports higher-speed assembly with instant green strength, offering productivity improvements in both solar frame and junction box sealing.

Krayden Inc.

Microjoin

Industry Directory | Manufacturer

Microjoin specializes in offering microwelding, heat seal, hot bar and welding assembly equipment used in bonding and microjoining of miniature mechanical and electrical sub-assemblies.

Henkel Launches New Fast Cure Silicone Ideal for Added Stability within Harsh Environments

Industry News | 2008-04-22 21:03:49.0

To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.

Henkel Electronic Materials

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Technical Library | 2021-05-13 16:03:25.0

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed

University of Seoul


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