Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Industry News | 2014-03-27 11:31:00.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Industry News | 2015-07-06 19:08:22.0
Seika Machinery now carries the MALCOM RDT-250C Reflow Simulator. The system can reproduce the temperature profile of a reflow oven while allowing operators to observe the melting state of solder paste and record the process.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2017-03-21 15:05:07.0
Techcon Systems will exhibit in Stand 1H39 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The Techcon team will demonstrate the TS8100 Series Positive Displacement PC Pump, TS9000 Jet Valve, TS9300HM Hot Melt Valve, and TSR2201 Dispensing Robot.
700 X 800 X 950mm 0.05mm Precision Hot Bar Soldering Machine Automatic Soldering Robot Equipment operation description The main parameters of the hot press equipment are temperature, time and pressure,and the three elements are controlled, and
Industry News | 2017-07-17 19:09:09.0
Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.
Industry News | 2019-01-16 09:48:30.0
Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
