Industry News | 2008-04-22 21:03:49.0
To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.
Industry News | 2011-12-29 17:27:04.0
Molex CMC product line has expanded with the introduction of a 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers. Designed to perform in high-conductivity applications and harsh environments, CMC is an industry standard interface used in automotive and transportation powertrain applications, including ECUs (engine control units), automatic gearboxes, suspension controllers and electric parking brakes.
Industry News | 2013-03-04 12:11:10.0
Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications. The new alloy, which addresses the drawbacks certain products experience with traditional SAC alloys, has been proven as a viable lead-free solution for applications where extremely high reliability is required.
Industry News | 2008-08-14 14:51:51.0
Essemtec announces that it has developed a special twin vacuum table for its placement machine FLX2011-MKL that eases the handling of flex boards and film substrates and doubles productivity.
Industry News | 2013-07-09 14:00:26.0
Optimized for fast, accurate and reliable bond testing in the volume manufacturing environment
Industry News | 2013-11-13 14:31:30.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded the 2013 Editor’s Choice Award from Global SMT & Packaging magazine for its 4000 Optima Bondtester with unique multi-function cartridge (MFC).
Industry News | 2023-03-27 14:51:47.0
We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.
Industry News | 2010-08-17 14:51:15.0
Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK’s new Wafer Transport Solution.
Industry News | 2011-03-10 21:20:06.0
Juki Corporation will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO.
Industry News | 2018-01-24 20:59:22.0
Seika Machinery today announced plans to exhibit in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. Seika will showcase a complete lineup of leading-edge equipment, including the latest models from McDry, Sawa, Sayaka, HIOKI and MALCOM.
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