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IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2016-08-23 16:25:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Essemtec to Define a New Standard - Paraquda is the world’s most advanced pick-and-place machine

Industry News | 2009-11-11 13:39:57.0

Paraquda is the newest SMD pick-and-place machine that Essemtec has introduced at the Productronica exhibition in Munich, Germany. The machine sets a new standard for flexible placement machines: Drive technologies, materials and software are state-of-the-art, machine operation is a user friendly and the application range is wider than ever before.

ESSEMTEC AG

Nest Soft

Industry Directory | Recruiter / Employment Company

Jobsinworld is a new job site with advanced technology used for searching openings from all job sites, worldwide. We are syndicated with job sites worldwide through RSS jobs technology.

Excel Enterprises L.P

Industry Directory | Other

Exec and tech search specializing in SMT Hybrid Advanced packaging Industries

LeCroy HDO4104

LeCroy HDO4104

Used SMT Equipment | In-Circuit Testers

Teledyne LeCroy HDO4104 Bandwidth: 1 Ghz Channels: 4 1 GHz Bandwidth, 4 Input Channels, 2.5 GS/s HDO4000 oscilloscopes combine Teledyne LeCroy's HD4096 high definition technology with long memory and powerful debug tools in a compact form facto

Test Equipment Connection

LeCroy HDO4104

LeCroy HDO4104

Used SMT Equipment | In-Circuit Testers

Teledyne LeCroy HDO4104 Bandwidth: 1 Ghz Channels: 4 1 GHz Bandwidth, 4 Input Channels, 2.5 GS/s HDO4000 oscilloscopes combine Teledyne LeCroy's HD4096 high definition technology with long memory and powerful debug tools in a compact form facto

Test Equipment Connection

Excel Enterprises L.P.

Industry Directory | Consultant / Service Provider

Executive and Technical Search in Photonics, SMT, Hybrid and Advanced Packaging Industries

Research – Tin Whiskers, Copper Dissolution, Legacy

Research – Tin Whiskers, Copper Dissolution, Legacy

New Equipment | Education/Training

The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently

Rosebud Electronics Integration Corp.


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