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SynTECH™ No-Clean Solder Paste

SynTECH™ No-Clean Solder Paste

New Equipment | Solder Materials

8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce

AMTECH

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

New Equipment | Solder Materials

Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp

Kapp Alloy & Wire, Inc

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

New Equipment | Components

Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1

KIC Thermal

Electrically Conductive Adhesives

Electrically Conductive Adhesives

New Equipment | Materials

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring

Zymet, Inc

Surface Mount Epoxy 4089

Surface Mount Epoxy 4089

New Equipment | Dispensing

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, 

AIM Solder

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

G2 Technology

Industry Directory | Consultant / Service Provider

G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.

LGInternational

Industry Directory | Manufacturer

LGInternational develops advanced labeling solutions for semiconductor, storage media, life sciences, & electronics applications. LGI�s products are used for product identification and decoration, product assembly, product packaging and security.

NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

New Equipment | Solder Materials

High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing

AMTECH

Premo-Flex™ FFC and Etched Polyimide Jumpers

Premo-Flex™ FFC and Etched Polyimide Jumpers

New Equipment | Components

Premo-Flex™ FFC and etched polyimide jumpers, available in a variety of pitches, cable lengths and thicknesses, plus high-temperature ratings up to +105°C, deliver durable, ultra flexible, competitively priced solutions for PCB connections in virtual

Molex


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