Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Thu Jun 29 04:07:25 EDT 2006 | slaine
Hi I manufacture a range of components with Ag,Pd,Pt terminatons. Has the solder wetted to the componet and is the termination still left on the component? I would expect the solder to remain on the pad though, if all your other devices on the pcb ar
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Fri Aug 30 04:44:31 EDT 2002 | jason
Hi Dave, Why does it become " a bear" if u leave it unsoldered ?? Does it oxidise or something ?? Question (1): Does Ag imm. PCB need to use Solder paste with AG ?? If yes, why. Question (2): Does Ag imm pcb have poorer surface finishes than HAS
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
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