Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve
I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met
Electronics Forum | Mon Sep 23 14:08:38 EDT 2002 | rocco
Hello My question is if the diferent types of allows that components manufacturers have considered like SnAg,SnCu,SnBi,NiPd,etc for platings instead Pb Have special handling at storage,floor handling and re-using as well as reworking ... Consideri
Electronics Forum | Wed Oct 02 11:44:58 EDT 2002 | slthomas
We found that a slightly more active flux was all we needed to provide sufficient wetting on the one AgPd part we put down. Unfortunately the paste we tried also slumped terribly, so we nixed that fix. It's a low volume product (50, once every 3 mo
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Tue May 23 09:50:37 EDT 2006 | flipit
They work well in silver conductive epoxy in hybrid applications. They are very poor in no clean applications. They don't work that well in OA solder paste either. Used them once in OA paste and in a nitrogen. They looked just fine. Solder to Pd
Electronics Forum | Fri Jun 30 06:47:51 EDT 2006 | AR
Hi All the other components on the PCB solder just fine, including resistors, ceramic capacitors, inductors, SOT23 etc. etc. so I do not think that it is a PCB problem. It is clearly focussed on this single component. Haven't yet tried scraping or
Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas
Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Wed Aug 29 11:07:39 EDT 2007 | mikecollier
I am being asked to perform the same evaluation now with a Au/Pd termination varistor. We currently use a Pb/Sn process with an RMA flux. The manufacturer of the device recommends going to a 2% silver paste. What is the intended advantage with 2%
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