Full Site - : ag pd viscosity (Page 16 of 19)

Palladium poor wetting

Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef

First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s

Soldering to Inconel 600 Alloy

Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef

Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.

Ag/Pd Component Finish

Electronics Forum | Thu Jun 29 06:26:36 EDT 2006 | AR

Hi Slaine, The terminations are still present on the component but all the solder (including the pad finish) has coalesced on to the terminations. The termination that normally is shiny and bright in colour has turned matte grey on that zone where t

Ag/Pd Component Finish

Electronics Forum | Fri Jun 30 06:07:12 EDT 2006 | slaine

Hi If all the solder has collected onto the component termination then it sounds more of a PCB problem then a component problem. Some times all the temination can be stripped off the ceramic with high tin content solders and leave a gray finish behi

Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford

AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no

Thickness of layers en MLCC ?

Electronics Forum | Wed Sep 22 03:23:40 EDT 1999 | Jeanjean

Dear all, First, I'd like to thank every one of you who have been a great help for my last questions. Then, I have heard that in multilayer ceramic capacitors, each layer of ceramic was about 3 micrometers at least. When adding the layer (which I d

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef

There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows

Voiding Control on AuSn preform reflow process

Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca

I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1

PCB Gold Pad Corrosion.

Electronics Forum | Thu Apr 20 14:59:11 EDT 2017 | davef

It's difficult to tell anything from your picture. But playing the odds, I'd say it's not "gold corrosion." It is very difficult to corrode gold. Gold is a NOBLE metal. From Wikipedia, the free encyclopedia In chemistry, the noble metals are metals

Re: Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean

| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar


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