Industry News | 2015-03-10 11:09:24.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2023-12-11 12:44:13.0
The Belen, NM, USA site opened in 1983 and has been processing responsibly mined bentonite clay into desiccant packets and bags for the past 40 years
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
Industry News | 2012-06-12 13:07:13.0
ABB Semiconductors in Lenzburg, Switzerland, long searched for a suitable production storage system for HiPak IGBT modules production. Project Manager Prabath Lewdeni found the SMD Tower by chance. Its supplier Essemtec re-engineered the SMD component storage system into clean room storage for ABB.
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Mon Jul 22 17:29:03 EDT 2013 | jorge_quijano
I have Ag & ENIG finishes, for Ag I've seen some oxidation, specially if the bag is not sealed propperly. Is there any real due date for PCBs?
Electronics Forum | Mon Sep 21 15:06:05 EDT 2009 | rramplin
I know the approximate shelf life for good and OK storage of ENIG and Ag boards but I do not know what these times are like for HASL. Can anyone help me out here. Thanks.
Electronics Forum | Mon Aug 28 17:04:52 EDT 2006 | Board House
ImSn - Immersion Tin - Not Recomended- short shelf life ImAg - Immersion Silver - Prefered Surface finsh by most Board houses, Best reworkablility, 12 moth self life, ENIG - Electroless Nickel Immersion Gold - Second Choice for Board Shops, 12 -
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose
Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar
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