Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose
Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar
Electronics Forum | Mon May 13 11:17:57 EDT 2002 | genny
I think for our company, the reason we have not yet tried it is two fold. One - we are just barely starting to see a need on a new product under design for a flat finish, so currently we don't use any of the really flat finishes available. Two - Silv
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt
I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
