Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
The new LiquiPrep material preparation and feeding unit https://www.scheugenpflug-dispensing.com/en/news/press-releases/article/the-new-liquiprep-material-preparation-and-feeding-unit-415.html Scheugenpflug has launched a new generation of its prov
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
The LeanCNCell is a production system designed to handle all metering and dispensing tasks for small and medium-sized batch production. Standard applications include applying or sealing of electronic assemblies and their housings with 1D, 2D or 3D co
Industry News | 2007-10-29 17:10:53.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
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