Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Industry News | 2007-09-25 21:42:42.0
Agilent Technologies Inc. (NYSE: A) today announced that the U.S. Navy has selected the company's test equipment for the General Purpose Electronic Test Equipment program.
Parts & Supplies | Repair/Rework
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Parts & Supplies | Repair/Rework
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
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Industry News | 2007-10-23 02:23:25.0
Agilent Technologies Inc. (NYSE: A) today introduced the enhanced version of the Agilent VEE 8.5 graphical programming software for test and measurement, equipping users with more functions and support for the latest software tools and operating systems in the industry, including Windows Vista.
Industry News | 2002-05-09 08:34:06.0
Trautman Replaces John Scruggs
Industry News | 2007-11-30 00:23:24.0
SANTA CLARA, Calif., Nov. 26, 2007 -- Agilent Technologies Inc. (NYSE: A) today announced its IO Libraries Suite 15.0, which has an improved LAN-discovery interface that simplifies the finding and configuring of LXI and other LAN-capable instruments.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
