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Round Robin of High Frequency Test Methods by IPC-D24C Task Group

Technical Library | 2017-06-29 16:39:30.0

Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent. The D-24C Task Group of IPC has developed this round robin program to assess these various methods from the "bottom up" to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.

DuPont

Maintenance Scheduling Software

Maintenance Scheduling Software

New Equipment | Software

Work order scheduling focuses on getting the right skills, parts, tools, appropriate instructions, permits and safety procedures together when the equipment is available. And, just when you think you have it figured out someone calls in sick or produ

AssetPoint

Design for Testability and for Built-in Self Test

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

EECS at University of California

Asia-Tech.com

Industry Directory | Other

The US-Asia Marketplace for Electronic and Semiconductor Components

FPCWay

Industry Directory | Consultant / Service Provider

Full feature custom flex PCB prototype service at low cost. FPCWay has been committed to meeting the needs of our customers by providing the best and most efficient flex PCB Manufacturer experience from flex pcb quote to deliver

Effects of Package Warpage on Head-in-Pillow Defect

Technical Library | 2017-07-06 15:50:17.0

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.

Samsung Electronics

Injection Molding

Injection Molding

New Equipment | Other

Our operation includes injection molding, tooling, painting, printing, hot stamping, and assembly. Customer ODM/OEM is welcome. We offer expert services in raw material selecting, prototype, problem solving, tooling design, manufacture and modificati

APLUS Products, LLC

SMD Snap Lock Reels

SMD Snap Lock Reels

New Equipment | Tape and Reel Equipment

For over 15 years, Mid America has been leading the industry evolution to larger reels, 15 and 22 inch. This is driven from the desire for increased placement efficiency and reduced changeover time, resulting in significant cost reductions. The 15 in

Mid America Taping and Reeling, Inc.

Ardent LLC

Industry Directory | Consultant / Service Provider / Other

Ardent help companies to Find, Set up and , Manage their indeprndent sales organizations in the USA Providing a low cost solution to sales and sales management


agreed searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

High Precision Fluid Dispensers
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
Electronics Equipment Consignment

High Resolution Fast Speed Industrial Cameras.