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MDE Semiconductor

Industry Directory |

MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.

SN100C P810 D4 low-voiding lead-free solder paste.

SN100C P810 D4 low-voiding lead-free solder paste.

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Nihon Superior Co., Ltd.

SN100C Solder Paste Products

SN100C Solder Paste Products

New Equipment | Solder Materials

FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec

FCT ASSEMBLY, INC.

AIM Solder products now available through online leader Stanley Supply & Services

Industry News | 2012-11-12 00:30:12.0

AIM Solder has teamed up with the electronic manufacture supply leader, Stanley Supply and Services, to offer AIM's advanced solder products such as lead-free bar solder, wire solder, solder epoxy, and solder paste through Stanley Supply & Services e-commerce site.

AIM Solder

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

Nihon Superior Introduces SN100C (551CT)

Industry News | 2011-08-18 12:44:10.0

Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.

Nihon Superior Co., Ltd.

AIM to Highlight World-Class Solder Materials at SMTA Indiana 2012

Industry News | 2012-03-13 11:26:59.0

AIM will highlight NC258, NC265LR, NC275LR & SN100C at the upcoming SMTA Indiana Expo & Trade Forum.

AIM Solder

Nihon Superior USA Exhibits SN100C at IPC International Conference on Flexible Circuits 2008

Industry News | 2008-02-15 15:45:43.0

OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.

Nihon Superior Co., Ltd.

FCT Assembly Now Offers Lab Services at Its Colorado Facility

Industry News | 2009-10-16 19:20:15.0

GREELEY, CO — FCT Assembly announces that lab services are now offered at its Greeley, CO facility. Conventional 63/37, SN100C® lead-free and SAC305 alloys can be analyzed at the facility.

FCT ASSEMBLY, INC.

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.


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